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 CES-471 - COM-Express CPU Module        

                                                        

 

 

- Features

- Specifications

- Ordering information

- Datasheet (PDF)

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- Technical Document

  • Support Intel® Core™ 2 Duo mobile processor Merom with Socket P @ 533/800 MHz FSB

  • 1 x DDR2 SO-DIMM support up to 2.0 GB .

  • Intel® GME965 & ICH8M Chipset.

  • Intel® GME965 built-in GMA X3100 VGA , LVDS 

  • SATA . USB 2.0 , Intel® Giga LAN

 Specifications

Formfactor

COM Express Basic ( 95 x 125 mm) , Type 2 connector layout

 

CPU  Type

Support  Intel® Core™ 2 Duo processor Merom with Socket P @ 800 MHz FSB .

 

Chipset

Intel® GME965 & ICH8M . 

 

Memory Type

1 x DDR2 SO-DIMM support up to 2.0 GB .

 

VGA Interface

Intel® GME965 Integrated GMA X3100 Technology . 

 

LVDS Interface

24-bit Dual channel LVDS interface .

 

Enhanced IDE

One UltraATA/100 IDE up to 2 ATAPI .

 

Series ATA

Integrated Series ATA controller facilities high-speed data transfer

up to 300MB/s for each of 3 ports .

 

LAN Interface

10/100/1000 Mbps Ethernet port provide by  Intel® 82573 .

 

Audio

Intel®  ICH8M HD Audio .

 

USB

Intel® IC8M contains an EHCI and four UHCI controller support 8 x Hi-Speed USB2.0 ports .

 

PCI-Express Interface

1 x PCI-Express x16 interface

4 x PCI-Express x1 interface 

 

PCI Interface

Support 4 x external PCI bus interface .

 

 

 Ordering information
 

CES- 471       Intel® Core™ 2 Duo in Socket-P COM Express CPU Module with Intel® GME965 chip

 

 


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