LE-37P
3.5 inch Miniboard Intel® Tiger Lake 11th Gen H Processor
Support Intel® Tiger Lake 11th Gen H Processor. 
DDR4 up to 32 GB, integrated HDMI, DisplayPort, LVDS, 1 x Giga PHY LAN, 1 x 2.5Giga LAN, 
6 x USB 3.2 Gen2, 1 x USB3.2 Gen2 (Type E), 2 x USB 2.0, 2 x RS232/422/485, 2 x RS232,  
2 x SATA3 with RAID, GPIO, SMBus, 1 x Mini-PCIe with SIM slot (support mSATA), HD Audio, 
1 x M.2 (Key E 2230), 1 x M.2 (Key M 2280) PCIe Gen4, 1 x M.2 (Key M 2280) PCIe Gen4 and SATA
 

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Overview
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Feature
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Specification
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Product Image   I/O
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Ordering Guide
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Datasheet (PDF format)
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Technical Document
  Overview
Taiwan Commate Computer Inc.(COMMELL), the worldwide leader of Industrial Single Board Computers,
unveiled LE-37P 3.5 inch Miniboard embedded system board based on Intel® Tiger Lake /11th Gen H processors.

The LE-37P 3.5 inch Miniboard platform is designed for Intel® Tiger Lake /11th Gen H processors 
in the FCBGA1787 sockets.support DDR4 memory (One DDR4 SO-DIMM 3200 MHz up to 32GB).

The platform is based on Intel® 11th Gen integrated UHD Graphics, this GPU offers 32 execution units (EUs) 
clocked at up to 1350Mhz(depending on the CPU model). Displays can be connected via one LVDS,
one HDMI and one DP port up to Triple displays can be controlled simultaneously. LE-37P offers lots of features 
including high-speed data transfer interfaces such as 6 x USB3.2 Gen2 and 2 x SATA3, equipped with dual 
Gigabit Ethernet, and comes with 2 x RS232 and 2 x RS232/422/485, 2 x USB2.0, Intel® High Definition Audio, 
1 x M.2 Key E 2230, 1 x M.2 Key M 2280 support PCIe Gen4, 1 x M.2 Key M 2280 support PCIe Gen4 and SATA,
1 x MiniPCIe socket with SIM slot (support mSATA).   

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  Key Feature

 

  • CPU: Intel® Tiger Lake 11th Gen H Processor.

  • Chipset: Intel® QM580E / RM590E.

  • Memory: 1 x DDR4 3200 MHz SO-DIMM up to 32 GB.

  • Integrated Graphics: Intel® UHD Graphics.

  • LVDS interface: Onboard LVDS connector.

  • DisplayPort interface: Onboard DisplayPort connector.

  • HDMI interface: Onboard HDMI connector.

  • LAN Interface: 2 x RJ45 LAN.

  • Serial ATA: Support 2 x SATA3.

  • Audio: High Definition Audio.

  • Internal I/O: 2 x SATA3, 2 x RS232, 2 x RS232/422/485, 2 x USB2.0, 1 x LVDS, 1 x LCD inverter conector, 1 x GPIO, 1 x Audio, 1 x SMBus, 1 x USB3.2 Gen2 (Type E).

  • Rear I/O: 1 x DisplayPort, 1 x HDMI, 6 x USB3.2 Gen2, 2 x LAN, 1 x DC jack.

  • Expansion: 1 x MiniPCIe with SIM slot (support mSATA), 2 x M.2 Key M 2280,1 x M.2 Key E 2230.

  • GPIO interface: 8-bit Digital I/O interface.

  • Power requirement: 9~35V.

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  Specification
 

Form Factor

3.5" Single Board Computer

Processor

Intel® Tiger Lake 11th Gen H Processor

Package Type: FCBGA1787

Memory

1 x 260-pin DDR4 3200 MHz SO-DIMM up to 32GB (Support Non-ECC, unbuffered memory)

(TGL-H Xeon CPUs can support ECC memory)

Integrated Graphics

Intel® 11th Gen integrated UHD Graphics

Real Time Clock  

Chipset integrated RTC with onboard lithium battery  

Watchdog Timer

Generates a system reset with internal timer for 1min/s ~ 255min/s

Serial ATA Interface

Intel® built-in 2 x Serial ATA3 interface up to 600MB/s 

Support RAID 0, 1 and Intel Rapid Storage Technology.

LVDS Interface

Onboard 18/24-bit dual channel LVDS connector with +3.3V/+5V/+12V supply

 DisplayPort Interface  Onboard DisplayPort connector
 HDMI Interface  Onboard HDMI connector

Audio Interface

 
Realtek ALC888S HD Audio

LAN Interface

1 x Intel® I219-LM Gigabit LAN (Support Intel® AMT 15.0)

1 x Intel® I225-LM Gigabit LAN (Up to 2.5GbE)

GPIO Interface

Onboard programmable 8-bit digital I/O interface

Expansion 

1 x MiniPCIe with SIM slot (support mSATA)

1 x M.2 Key M 2280 support PCIe Gen4 and SATA

1 x M.2 Key M 2280 support PCIe Gen4

1 x M.2 Key E 2230 for Wi-Fi and Bluetooth

Internal I/O Port

2 x SATA3, 2 x RS232/422/485, 2 x RS232, 2 x USB2.0,

1 x LVDS, 1 x LCD inverter connector, 1 x GPIO, 1 x SMBus,

1 x Audio (MIC-in & Line-out), 1 x USB3.2 Gen2 (Type E)

Rear I/O Port

1 x DisplayPort, 1 x HDMI, 6 x USB3.2 Gen2, 2 x LAN,

1 x DC jack

Power Requirement

DC jack 9~35V

Board Dimension

146 mm x 101 mm (L x W)

Temperature

Operating within 0 ~ 60°C (Note1)

Storage within -20 ~ 80°C

Relative Humidity

10%~90%, non-condensing

Download Datasheet @ PDF format

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  Ordering Guide

LE-37P7

With CoreTM i7-11850HE, QM850E + Cooler Fan, support HDMI, DP, LVDS

ADP-3355

DisplayPort to VGA module (For VGA)

ADP-3460

DisplayPort to LVDS module (For 2nd LVDS)

Note1: W-11865MRE, W-11555MRE, W-11155MRE can operate within -40°C~85°C (-40°F~185°F).

Note2: If you want to use other TGL H CPU (i5-11500HE, i3-11100HE, W-11865MRE,

W-11865MLE, W-11555MRE, W-11555MLE, W-11155MRE, W-11155MLE, 6600HE),

please contact with our sales.

Note3: There are two module ADP-3355, ADP-3460; and you can choose one to support VGA or 2nd LVDS, please contact with our sales for OEM version.

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